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实习研发硬件工程师

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实习研发硬件工程师

浙江意博高科技术有限公司

实习研发硬件工程师

1 month ago

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Important information


Contract type:

Permanent

Location:

Hangzhou, Zhejiang, China

Work mode:

Onsite

Published on:

12 September 2026

What they need


该职位来源于猎聘 岗位职责 1、负责新品研发和产品优化工。 2、负责为内外部客户提供产品技术支撑; 3、负责编制自主研发产品的规格书和技术文档工作。 任职要求 1、本科或以上学历,电子相关专业,有扎实的模电、数电基础; 2、熟悉开关电源电路,LED驱动电源常用的拓扑结构(buck,boost,buck-boost,cuk,zeta,sepic变换器); 3、熟练掌握半导体器件工作原理,并能在器件选型和参数设计上有技术和成本意识; 4、熟练使用PROTEL等线路设计,对LED电源不同区域和国家相关规格、安规要求、EMI/EMC以及认证程序有深入地了解和认知; 5、要求性格踏实沉稳,工作态度认真严谨,具备较强的团队合作精神和创新精神。

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