南京正大天晴制药有限公司
硬件专家
1 month ago
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Important information
Contract type:
Permanent
Location:
Dongguan, Guangdong Province, China
Work mode:
Onsite
Published on:
26 September 2026
What they need
该职位来源于猎聘 岗位职责：
- 负责摄像头模组产品的硬件方案设计及PCB Layout开发，确保产品良率达到98%以上
- 主导完成至少3款百万级像素摄像头模组的硬件设计任务
- 协调FPC/PCB供应商完成阻抗匹配设计，将信号完整性控制在±5%误差范围内
- 编写全英文技术文档，每周完成2次跨国团队技术同步会议
任职要求：
- 电子工程相关专业本科以上学历，8年以上摄像头模组PCB设计经验
- 精通Cadence/Allegro设计工具，独立完成过4层以上HDI板设计
- 熟悉MIPI/CSI-2等摄像头接口协议，有5个以上量产项目经验
- 英语CET-6级以上，能熟练撰写技术文档并进行跨国技术交流
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