东微半导体
工科应届硕士生（南通）
1 month ago
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Important information
Contract type:
Permanent
Location:
Nantong, Jiangsu, China
Work mode:
Onsite
Published on:
28 September 2026
What they need
该职位来源于猎聘
- 参与半导体晶圆清洗设备的研发设计，负责机械结构、工艺流程或控制系统的开发与优化；
- 深度学习并参与产品设计理念；
- 由部门经理/总经理直接带教、直接管理，聚焦半导体晶圆清洗设备核心技术深耕
专属成长晋升阶梯（4年完整体系）：工程师 → 资深工程师 → 技术主管 任职要求 1、硕士及以上学历，机械、材料、微电子、自动化、软件工程等相关专业； 2、有志于从事半导体晶圆清洗设备研发工作，接受机械、工艺、软件等多方向研发岗位适配； 3、具备良好的逻辑思维、学习能力和问题攻关能力，踏实肯干，愿意深耕半导体设备核心技术领域；
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