捷普科技(上海)有限公司
组件及主板工程师
16 days ago
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Important information
Contract type:
Permanent
Salary:
CN¥300,000 – CN¥600,000 / year
Location:
Xi'An, Shaanxi, China
Work mode:
Onsite
Published on:
9 October 2026
What they need
该职位来源于猎聘 职位描述: 参与芯片组件及主板开发; 负责芯粒,主板和模组的架构设计; 负责主板电路设计和产品的参考设计; 负责和用户硬件方面要求的沟通。 任职要求: 电子专业硕士学位,或有电子专业学士学位并有行业工作经验(2年以上); 有主板及模组设计经验,对芯粒架构,芯片封装有一定的了解; 熟练掌握主板及模组设计技术; 能完成主板电路设计和产品的参考设计。
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