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硬件应用实习生

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Onsite

硬件应用实习生

成都市易冲半导体有限公司

硬件应用实习生

11 days ago

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Important information


Contract type:

Permanent

Salary:

CN¥2,160 – CN¥2,400 / year

Location:

Chengdu, Sichuan, China

Work mode:

Onsite

Published on:

15 October 2026

What they need


该职位来源于猎聘 岗位职责: 在指导下进行芯片评估板的硬件制作和测试,技术相关文档的编写。 岗位要求: 1.电子、通信、计算机、自动化等相关专业硕士及以上学历; 2.熟练使用Protel、Altium Designer、Cadence(Allegro)等工具绘制电路原理图及PCB图; 3.熟悉模拟电子与数字电子技术,熟悉单片机外围电路设计,具有一定的编程基础; 4.熟悉硬件设计流程,熟悉硬件设计理论和方法,有较强的学习能力和逻辑分析能力; 5.熟悉开关电源、驱动电路设计优先;有硬件电路设计及调试经验者优先; 6.有良好的英语阅读能力,能够阅读英文资料、文献。

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