大阪化合（株）
研发工程师-加工工艺
8 days ago
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Important information
Contract type:
Permanent
Salary:
CN¥132,000 – CN¥240,000 / year
Location:
Xiamen, Fujian, China
Work mode:
Onsite
Published on:
15 October 2026
What they need
该职位来源于猎聘 职位职责和职位要求 (Job Responsibilities & Requirements)： 1、负责优化现有金刚石单晶与多晶的研磨抛光加工等后端加工工艺，协助制定质量标准和生产标准； 2、负责开发新的金刚石加工工艺，比如CMP等； 3、负责配合相关工艺优化，改进研磨抛光设备等； 4、其他领导安排的工作； 任职要求： 1、熟悉宽禁带半导体材料或硬脆材料的超精密加工，包括研磨、抛光、激光切割等工艺； 2、熟悉金刚石材料或者其他宽禁带半导体材料或硬脆材料的物理性质与加工原理; 3、机械、物理学、材料学相关专业，本科学历及以上，具有工艺开发经验五年以上，研究生可放宽，有金刚石加工或者其他半导体材料加工经验的优先考虑； 4、有3年左右光学产品加工经验 5、团队合作能力强、沟通协调能力强，执行能力强；
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