申港证券股份有限公司
高速光芯片研发工程师
3 days ago
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Important information
Contract type:
Permanent
Salary:
CN¥10,000 – CN¥20,000 / month
Location:
Zhangzhou, Fujian, China
Work mode:
Onsite
Published on:
17 October 2026
What they need
该职位来源于猎聘 岗位职责: 1.负责DML/EML下一代高速光芯片产品的设计、仿真与开发; 2.与芯片工艺团队合作,优化试验设计和分析新芯片的设计结果; 3.参与光芯片新产品项目,主导新产品数据分析及设计目标验证; 4.参与InP体系四元化合物材料量子阱结构设计以及MOCVD外延生长; 5.负责高速率DML/EML芯片失效分析,与团队讨论优化方案。 任职资格: 1.硕士及以上学历,电子、通讯、半导体、光电等相关专业; 2.具备系统的半导体激光器和光电探测器理论知识及仿真设计方法; 3.熟悉半导体工艺流程; 4.良好的团队合作精神和沟通能力。
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