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Collaboration Strategic Technology Lead (AI Systems & Computing Architecture)

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Onsite

Collaboration Strategic Technology Lead (AI Systems & Computing Architecture)

Huawei

Collaboration Strategic Technology Lead (AI Systems & Computing Architecture)

Skills

RMachine LearningAI

17 days ago

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Important information


Contract type:

Permanent

Location:

Zürich, Switzerland

Work mode:

Onsite

Published on:

11 October 2026

What they need


About Us At Huawei Technologies Switzerland AG, we are a leading technology firm dedicated to developing cutting-edge solutions that redefine industry standards and push technological boundaries. Our core focus is on creating advanced computing architectures that can efficiently support and enhance the performance of artificial intelligence systems. We believe in innovation as a driving force for improvement and are committed to achieving excellence in all areas of research and development.

Role Overview We are seeking a high-caliber Collaboration Strategic Technology Lead to serve as the strategic bridge between world-class academic research and industrial product evolution. In this role, you will drive the full lifecycle of external collaboration projects, from identifying potential / trendy technologies in computer architecture and AI algorithms to ensuring these innovations are successfully integrated into our next-generation hardware-software systems. You will act as a Technological Diplomat , aligning internal business requirements with global academic excellence to accelerate the transformation of research into industrial value.

Key Responsibilities

  • End-to-End Collaborative Project Management

Lifecycle Oversight: Manage the full collaborative project flow: requirements alignment, technical solution design, project initiation, phase reviews, and final acceptance.

Internal Alignment: Coordinate between local research teams and Headquarters technical leaders to ensure research outcomes are synchronized with internal product timelines.

Resource Orchestration: Steer cross-functional teams toward well-defined goals, managing the delicate balance between long-term research and immediate engineering constraints.

  • Strategic Analysis & Trend Mapping

Evaluate Emerging Tech: Conduct in-depth research (literature reviews, simulations, and trend analysis) on AI-empowered processors, accelerators, and heterogeneous systems .

Decision Support: Produce high-impact technical reports for Chief Scientists and Executives to guide the strategic roadmap of the Corporate Research and Business Units.

Feasibility Studies: Lead early-stage technical assessments to shape technical roadmaps for future innovation programs.

  • Technological Diplomacy & Partner Engagement

Strategic Academic Engagement: Cultivate and maintain high-level relationships with global faculty and elite research institutions. Proactively identify synergies between emerging scientific breakthroughs and the company's long-term technical roadmaps.

Ecosystem Building: Foster an international network of researchers, suppliers, and academic partners. Organize high-level exchange activities, including workshops, seminars, and technical competitions.

  • Research Transformation & Implementation

Value Acceleration: Drive the digestion and expansion of external research results. Facilitate the transfer of academic achievements into internal R&D pipelines to maximize industrial impact.

Prototyping & Validation: Support or oversee preliminary technical assessments and prototyping efforts to validate research feasibility for product integration.

Requirements & Qualifications Education & Experience PhD in Computer Architecture, Chip Design, Electronic Engineering, or a related AI-hardware field.

5+ years of experience in industry or academic research, specifically managing or participating in high-stakes collaboration projects.

Deep Technical Expertise in at least one of the following:

Architecture: CPU/GPU/NPU cores, SoC design, or AI accelerators.

AI/ML Systems: Modern AI models, and hardware-software co-design/optimization.

Advanced Packaging: Heterogeneous integration (3DIC), Chiplets, or thermal management.

Core Competencies Analytical Mindset: Ability to toggle between high-level strategic big picture and deep-dive technical details.

Project Leadership: A proactive, self-driven attitude with a proven track record of moving projects forward independently.

Exceptional Communication: A master of persuasion who can simplify complex concepts for stakeholders and navigate ambiguous, fast-paced environments.

Language Proficiency: Fluency in English is mandatory; proficiency in Chinese is highly preferred to ensure seamless communication with Headquarters.

What We Offer

  • Opportunities to collaborate with top academic institutions and leading experts in the field of computer architecture and chip design.
  • A dynamic and innovative work environment that values technological breakthroughs and achievement transformation.
  • Competitive compensation package, comprehensive benefits, and clear career development paths.

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