COO

Position: Chief Operating Officer (COO)

Location: Hong Kong (Headquarters) with frequent travel and station at manufacturing facilities in the PRC （Shenzhen)

About the Role

We are a publicly listed Printed Circuit Board (PCB) manufacturer seeking a decisive and strategic Chief Operating Officer to lead our next phase of growth and operational restructuring. Reporting directly to the CEO and the Board, the COO will be the primary driver of enterprise-wide operational efficiency, technological upgrading, and strategic turnaround initiatives.

Key Responsibilities

Operational Turnaround & Optimization: Design and execute comprehensive turnaround strategies to improve gross margins, optimize production yield, and streamline facility operations across all manufacturing sites.

Customer Sector Transitioning: Lead operations through strategic customer sector transitions, shifting capacity toward high-growth, high-margin sectors such as automotive electronics, AI infrastructure, and advanced telecommunications.

Advanced Materials & Technology: Oversee the operational readiness for next-generation manufacturing capabilities, including the evaluation and integration of advanced materials such as glass substrates to capture higher valuation multiples in the market.

M&A Integration: Partner with the executive team to evaluate operational viability for corporate acquisitions and lead the post-merger integration of newly acquired facilities or technological assets.

Cost & Resource Management: Implement rigorous cost-control measures across supply chain, procurement, and labor, ensuring the company remains highly competitive amidst shifting global trade dynamics.

ESG & Compliance: Ensure all operations meet stringent environmental, social, and governance (ESG) standards required by the HKEX and international clientele.

Qualifications

 15+ years of progressive leadership experience in the PCB or semiconductor manufacturing industry, with at least 5 years in a C-level or equivalent operational role.

 Proven track record of successfully executing operational turnarounds and managing complex customer portfolio transitions.

 Deep technical understanding of advanced PCB manufacturing processes, capacity planning, and emerging substrate technologies.

Fluency in English, Cantonese, and Mandarin.