CU PLATE ENGINEER

Responsibilities

• Handle Electroless Plating, Cu Plating, Flash Plating and Pulse Plating processes.
• Support plating process improvement, troubleshooting and optimization.
• Support product and process development for PCB manufacturing.

Requirements

• Degree in Chemical Engineering, Materials Engineering, Electronics Engineering or related field.
• Experience in Electroless Plating, Cu Plating, Flash Plating or Pulse Plating.
• Familiar with CSP, FC-BGA, SLP or other core-level PCB manufacturing is preferred.
• Good problem-solving and communication skills.
• Relevant PCB plating experience is an advantage.