Hinduja Tech Limited
Design Release Engineer - Interior TRIMS
8 days ago
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Important information
Contract type:
Permanent
Location:
Chennai, Tamil Nadu, India
Work mode:
Onsite
Published on:
13 October 2026
What they need
Role & responsibilities
- Designing and modeling of Interior Plastic Components.
- CAD design of trim components and plastic components- Door trim, Floor console, Pillar trims, Carpets, Insulation parts, Instrument panel and Rear quarter trim
- Design review with Global Technical Centre Team and converge on design solutions.
- Design release of components for every project milestone in the PLM system
- Packaging, Manufacturing and assembly feasibility study of trims components
- Responsible for releasing the components in the PLM system.
- Benchmarking study as and when required
- Interaction with supplier, PLM activities, Development Coordination, CFT Coordination, DVPR testing coordination with supplier and coordination with the SQE to bring the parts for build
- Very good experience and Expert in CATIA & Enovia
- Design Support for the analysis teams (Impact, Durability and NVH) to meet various Regulatory and test requirements
Preferred candidate profile
B.E./B. Tech or M.E/ M. Tech in Mechanical, Automobile, Production and Industrial Engineering
- 4 to 8 years of Product Design & development experience in automotive Trim Components: Hard Trim (Instrument panel, floor console, door trim, Pillar Trim, Scuff Plates, Quarter trim and Lift gate) Soft Trim (Headliner, Carpet, Dash insulator and Firewall Insulator)
- Working experience in Component & System level designing.
- Expertise in CATIA modeling, Surfacing and Ennovia.
- Good Knowledge in Manufacturing & Assembly feasibility study.
- Work experience with International Tier 1 and OEMS.
- Knowledge in Injection molding process.
- Good presentation and communication skills.
Desirable:
- Proficiency in Motion Simulation & CATIA Customization.
- Good knowledge on Manufacturing process (Thermoforming, Blow Molding, Compression molding etc. and Plastic Materials)
- Exposure in releasing the components in the PLM
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