Development Engineer

WORK EXPERIENCE: 3 - 4 years of Experience

SPECIAL ABILITIES / SKILLS DESIRED: WORK EXPERIENCE: SPECIFIC WORK EXPERIENCE: 1. For Die Attach + Clip Attach + Reflow Engineer: a. Knowledgeable and with hands-on experience in setting-up and operation of In-Line Die Attach ASM AD832i, Cu Clip Bonder ASM CB832 and Reflow ASM RO832 is a plus

2. For Mold / DTS a. Knowledgeable and with hands-on experience in setting-up and operation of Mold machine ASM Auto IDEAL Mold b. Knowledgeable and with hands-on experience in setting-up and operation of Deflsh/Trim/Singulate machine from HANMI TRIM 101 CP / FICO

3. For TMTT a. Knowledgeable and with hands-on experience in setting-up and operation of Tester Handler TMTT Handler(FT2026) / ISMECA NX32, Test and Laser Markin

SPECIAL ABILITIES / SKILLS DESIRED:

JOB DESCRIPTION OR WORK TO PERFORM

1. Handle development projects from start to Production Endorsement.

2. Coordinate and plan with the team the requirements/needs of Engg/Qualification lots for loading on project assigned

3. Spearhead the evaluations//DOEs, process release and Reliability tests required,

 4. Implement and adhere to APQP/QPEP-PPA activities

5. Generates and reviews process documents like specifications, work standard guides, OCAP, FMEA, Control Plan to be used and implemented in production.

 6. Plan Pre-production/Safe Launch activities and process monitors.

7. Drives / generates programs geared toward improvement in cost, productivity, and quality for manufacturing needs.

8. Ensures adherence to customer standards and quality of work to the satisfaction of customers (internal or external).

9. Ensures that SPC control chart are analyze and reviewed process capability will have action plan as needed.

10. Attends to all customer issues, provides data analysis and their corrective, improvement, and preventive measures.

11. Perform other related tasks that maybe assigned by his supervisor from time to time.

GENERAL QUALIFICATIONS:

1. More than 2 years experienced as Process Engineer gained from reputable semiconductor company

2. Trained and practitioner of engineering process tools, optimization, and improvement such as generating and review of FMEA, SPC, Design of Experiments, DMAIC, Problem Solving Methodology

3. Implemented at least 1 poka-yoke project

4. Experience in attending to customer concerns/issues pertaining to IC packaging assembly process, provides data analysis and corrective actions to improve and prevent issue recurrence.

5. Advantage to candidate with working knowledge in NPI (New Product Introduction) process using APQP and PPAP