Device & Process Integration Engineer

Role: Process Integration Engineer in the DRAM R&D Memory Group, focusing on developing core memory technology for AI-enabled applications.

Responsibilities

• Own process integration for front-end modules, defining schemes, managing unit processes, and meeting technology milestones.
• Design and execute Design of Experiments (DOEs), analyze silicon data, and troubleshoot root causes.
• Utilize device and process modeling (e.g., TCAD, Sentaurus) to evaluate interactions, device behavior, and scaling options, correlating simulations with experimental data to improve accuracy.
• Collaborate across teams including Process Development, Device Engineering, Yield, and Manufacturing to resolve technical issues.
• Summarize complex problems, develop recommendations, and facilitate consensus for solutions.
• Support technology transfer from R&D to manufacturing, ensuring successful implementation.

Qualifications

• Master’s or PhD in Electrical Engineering, Physics, Materials Science, or related field, with semiconductor industry experience.
• Experience in semiconductor process integration, development, and silicon-based troubleshooting.
• Knowledge of device physics and hands-on experience with process/device modeling tools.
• Proficiency in data analysis, DOE, and statistical techniques.

Preferred Skills: Experience with memory, logic, or advanced-node integration, model calibration, and technology transfer; strong communication and teamwork skills; self-motivated with technical problem-solving passion.