Comrise-Risewave
Die Attach Equipment Engineer
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Baguio, Benguet, Philippines
Work mode:
Onsite
Published on:
9 September 2026
What they need
Die Attach Equipment Engineer
Experience: 5+ years relevant experience
Education: Engineering/Science degree
Industry: Semiconductor / IC / Power Module Manufacturing
Main Responsibilities:
- Support and improve die attach / component attach manufacturing processes.
- Improve yield, efficiency, quality, cost, and cycle time.
- Troubleshoot process and equipment issues.
- Perform process experiments, data analysis, and root-cause analysis.
- Support new product introduction and manufacturing ramp.
- Handle lot/equipment disposition and process improvement projects.
- Work with Manufacturing, Equipment, Quality, and other engineering teams.
Key Technical Skills:
- Die Attach / Component Attach
- Flip Chip
- SMT / Screen Printing
- AOI / SPI / Reflow
- QFN, SMT packages, Power Modules
- SPC, DOE, DMAIC, 8D
- Process/yield improvement
- Semiconductor manufacturing
Pay: Php70,000.00 - Php80,000.00 per month
Benefits:
- Promotion to permanent employee
Experience:
- Die Attach: 4 years (Required)
- Semiconductor: 1 year (Required)
- Flip Chip: 1 year (Required)
Work Location: In person
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