Die Attach/Wire Bond Assembler

Position Summary:

Apply expertise in the assembly and packaging of semiconductor devices, specifically in die-attach and wire bond processes.

Essential Duties:

· Working on small components under a microscope.

· Build hybrid, multi-chip module, and integrated circuit package assemblies.

· Epoxy and eutectic die attach using manual die placement machine.

· Wedge bonding, ball bonding, and gap welding using manual and semi-auto wire bonding machines.

· Ensure proper alignments and bonding of the dies/components onto substrates.

· Conduct inspections under the microscope to identify and address any defects or discrepancies.

· Perform rework – removing epoxy/eutectic solder, die, and other components from the substrate.

Minimum Qualifications:

· Ability to read and write in English.

· Must have basic math skills.

· Must be a US Person

Requires a minimum of 3-5 years of related experience.

Key Competencies:

· Technical comprehension and ability to recognize deviation in area of expertise.

· Understanding of process specifications for die placement and wire bond.

· Excellent manual dexterity

· Ability to interpret assembly instructions, drawings, and work instructions.

Preferred Skills:

(Optional)

· Prior experience in a contract manufacturing environment.

· Experience with Hesse (BJ855, BJ939) K&S, and ASM wire bonders.

· Experience in working with ISO 9001, ISO 13485, and ITAR environments

Pay: $26.24 - $31.60 per hour

Expected hours: 40.0 per week

Benefits:

• 401(k)
• 401(k) matching
• Dental insurance
• Employee assistance program
• Employee discount
• Flexible spending account
• Health insurance
• Health savings account
• Life insurance
• Paid time off
• Referral program
• Tuition reimbursement
• Vision insurance

Work Location: In person