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Die Attach/Wire Bond Senior Equipment Engineer

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Onsite

Die Attach/Wire Bond Senior Equipment Engineer

Carsem (M) Sdn. Bhd

Die Attach/Wire Bond Senior Equipment Engineer

Skills

Data AnalysisCompliance

25 days ago

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Important information


Contract type:

Permanent

Location:

Ipoh, Perak, Malaysia

Work mode:

Onsite

Published on:

2 October 2026

What they need


Join our team and lead the way in driving equipment improvements and optimizing performance metrics such as OEE, downtime, MTBA, MTBF, and MTTR. As a Senior Equipment Engineer Die Attach/Wire Bond , you will guide a team of technical specialists and technicians to ensure excellence in semiconductor manufacturing. This position is essential to maintaining and improving equipment performance while implementing impactful improvement projects that enhance productivity and quality.

Key Responsibilities

  • Team Leadership: Supervise, train, and mentor technicians on equipment maintenance, machine setup, troubleshooting, and continuous improvement projects.
  • Productivity Optimization: Develop and implement plans to upgrade existing machines, improving OEE and product quality.
  • Maintenance & Reliability: Plan, organize, and execute maintenance activities to keep equipment in peak condition.
  • Vendor & Cross-Functional Collaboration: Work with vendors and internal teams to resolve machine issues and enhance performance.
  • Performance Analysis & Reporting: Oversee and report on critical performance metrics (OEE, downtime, MTBA, MTBF, and MTTR).
  • New Equipment Integration: Manage buy-off and setup of new equipment.
  • Audit Readiness: Follow up on internal and external audits to ensure compliance.
  • Continuous Improvement: Drive initiatives like Poka-Yoke/foolproof projects to enhance processes.
  • 5S Zone Leadership: Champion workplace organization and structure as a Zone Leader (where applicable).

Qualifications

  • Degree in Electrical & Electronics Engineering or Mechanical Engineering.

Experience

  • Previous experience in semiconductor manufacturing and assembly is preferred.

Special Skills

  • Hands-on expertise with ASM Die Attach, Alphasem Die Attach, and Esec Die Attach machines.

Other Attributes

  1. Proficiency in Microsoft Office tools (Excel for data analysis, Word/PowerPoint for reports and presentations).
  2. Strong team player with leadership capabilities.
  3. Skilled in statistical problem-solving methodologies.

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