Die Bond Engineer

Job Position/Title             : Die Bond Engineer

Minimum Requirement    :

·       Bachelor Degree in Electrical and Electronic Engineering

• Required language(s): Bahasa Malaysia, MANDARIN, English to effectively communicate with our diverse client base and stakeholders.
• Familiar with Machine:
  Die Attach (Four Technos. & Datacom) & Wire Bonding (K&S & Kaijo) is an advantage.

Report to                          : Level 1: Engineering Department HOD

Level 2: Executive Vice President

Level 3: NIL

Job Responsibilities         : -

1)    Support Front End Process:

(a) Die Attach

(b) Wire Bonding

(c) OGP measurement

(d) Plasma cleaning

(e) Laser Cutting

2)    Yield and process issue analyst.

3)    Yield and process improvement for Front End Process.

4)    Operator and technician training on process handling and machine operation.

5)    Machine issue troubleshooting.

6)    Perform any other duties and assignments as and when required by Superior from time to time.