Die/Layer Attach Process Development Staff Engineer

Key Responsibility:

• Support New Product Introduction (NPI), deliver assigned process and equipment development solutions that meet or exceed project quality, cost and timeline targets to ensure successful product industrialization.

• Drive Equipment Dual Sourcing & Cost Optimization. Establish qualified second-source equipment suppliers and introduce cost-effective processes or technologies to achieve equipment sourcing resilience and cost-saving objectives. Aligned with equipment strategy and manufacturing readiness requirements. Drive continuous process improvement initiatives focused on BOM material optimization and UPH (Units Per Hour) enhancement to achieve product cost targets while maintaining quality and operational efficiency.

• Resolve Chronic Technical Issues through Innovation. Lead or contribute to the resolution of recurring manufacturing and process challenges by applying innovative, data-driven, and out-of-the-box engineering solutions to improve yield, reliability, productivity, and cost performances.

• Contribute to Cross-Functional Problem Solving. Provide active technical leadership, analysis, and support in team-based problem-solving initiatives (e.g., Focus Teams, Task Forces, Problem Solving Team, Yield Improvement Projects, and Customer Issue Investigations) to ensure timely and sustainable issue resolution.

• Develop and Maintain Technical Competency. Continuously enhance technical expertise by maintaining and updating organizational knowledge relating to:

  • Design guidelines and design rules
  • Process know-how and best practices
  • Equipment capabilities and supplier technologies
  • Knowledge management systems and lessons learned

• Actively participate in internal and external knowledge-sharing activities, including technical symposiums, conferences, benchmarking sessions, trade shows, and engineering forums to strengthen organizational capability and innovation culture. This aligns with internal expectations for maintaining technical knowledge and sharing expertise across the organization

Requirements:

• Bachelor's Degree in Engineering (Mechanical/ Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
• More than 2 years in semiconductor Die Attach/Layer Attach process engineering field.
• Die Attach, Layer Attach process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
• Experience in Process development or New Product Introduction would be an advantage.
• Hands-on and process development experience in FOL related processes e.g. sawing, die attach and wire bond process.
• Strong analytical skill, systematic problem solving approach skill, statistical knowledge with knowledge of Six Sigma is preferred.
• An in-depth knowledge of Microsoft Excel, Word, PowerPoint and JMP is required.