Digital - Principal Systems/DSP Engineer

Join the leading chiplet startup! As the Principal Systems/DSP Engineer at Eliyan, you will define and drive the DSP architecture for next-generation 224G and 448G SerDes designs powering tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility. You will own the end-to-end system modeling, equalization algorithm development, and CDR architecture for industry-leading SerDes IPs implemented on advanced 3nm/2nm process nodes. You will work with a cross-functional team of experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits

Key Responsibilities:

• Define and architect low-power DSP architectures for 224G PAM4 and 448G SerDes designs, driving key trade-offs between power, performance, and area
• Develop and maintain behavioral models of mixed-signal transceiver circuits using MATLAB, Simulink, C, and/or Python for system-level performance prediction and design specification
• Develop, evaluate, and optimize equalization algorithms including FFE, DFE, CTLE, and MLSE/MLSD for 224G/448G channel loss and impairment compensation
• Derive and specify analog front-end (AFE), DAC/ADC, and PLL performance targets from system-level BER and link budget analyses
• Design and optimize adaptive DSP algorithms for channel compensation, including adaptation convergence strategies, calibration sequencing, and robustness across PVT corners
• Architect and evaluate clock and data recovery (CDR) algorithms and loop dynamics, including jitter tolerance analysis, bang-bang and linear CDR trade-offs, and frequency acquisition strategies
• Perform system-level simulations and trade-off analyses balancing power consumption (digital and analog), performance, and BER requirements
• Collaborate closely with analog, digital RTL, and physical design teams to ensure algorithm-to-implementation fidelity and power-efficient silicon realization
• Develop and evaluate FEC solutions including inner/outer FEC architectures, RS-FEC (KP4/KP8) integration, and concatenated coding schemes per IEEE 802.3dj and OIF CEI-224G standards
• Drive silicon bring-up and characterization test plans, correlating pre-silicon system models with post-silicon measurements to validate DSP performance
• Define lab validation methodologies and work with characterization teams on silicon debug, performance benchmarking, and standard compliance testing
• Provide technical leadership to customers and partners on system-level link performance, interoperability, and algorithmic optimization

Qualification:

• Masters or Ph.D in Electrical Engineering, Computer Engineering, or related fields
• 10+ years of experience in DSP system architecture and algorithm development for high-speed serial communication systems, with hands-on work at 112G PAM4 or higher data rates
• Deep expertise in digital communication and signal processing theory, including PAM4 modulation, equalization architectures, CDR loop dynamics, and statistical channel modeling
• Expert-level proficiency in system modeling using MATLAB, Simulink, C, and/or Python with demonstrated ability to build production-quality behavioral models
• Strong working knowledge of high-speed serial protocols and standards including Ethernet (IEEE 802.3ck/df/dj)), PCIe, UCIe, and OIF CEI specifications
• Solid understanding of mixed-signal circuit design concepts (DAC/ADC architectures, PLL phase noise, AFE linearity) and their impact on DSP algorithm performance and link budget
• Proven ability to collaborate across analog, digital, and verification teams to translate algorithmic intent into silicon-ready implementations
• Hands-on experience with 112G/224G SerDes products with proven tapeout or silicon characterization results
• Detailed knowledge of OIF CEI-224G and IEEE 802.3dj standards including link budget allocation, compliance test methodologies, and FEC performance metrics
• Experience with chiplet D2D interconnects, optical/electrical interfaces (VCSEL, EML), or DRAM/HBM PHY systems a plus