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DIP Engineer (under Dual In-line Package (DIP) - Process Dept)

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Onsite

DIP Engineer (under Dual In-line Package (DIP) - Process Dept)

Wistron Technology (Malaysia) Sdn Bhd

DIP Engineer (under Dual In-line Package (DIP) - Process Dept)

2 months ago

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Important information


Contract type:

Permanent

Location:

Kuala Selangor, Selangor, Malaysia

Work mode:

Onsite

Published on:

10 August 2026

What they need


  • Familiar with DIP Process (Dual In Line Package) in related to wave solder, glue dispenser, coating machine
  • Able to handle DIP equipment abnormal
  • Product quality issue tracking and solving to realize the goal yield rate
  • Assists in selective wave soldering, router and glue dispenser equipment programming and production
  • Do preventive maintenance DIP (Dual In Line Package) equipment
  • Improve cycle time on DIP process (Dual In Line Package)
  • Complete maintained router and valve of dispenser independently.

Job Requirements :-

  • Bachelor Degree or Diploma in Engineering (Mechanical/ Electrical/Electronics) etc with minimum of 1 year working experience in SMT environment. Diploma in Engineering with 6 years working in similar environment
  • Language required : Bahasa Melayu and English. We are also seeking candidates proficient in Mandarin to effectively communicate with our Mandarin speaking clients.
  • Required skills: Microsoft Office (Word, Power Point and Excel)
  • Daily maintenance arrangement, preparation of safety operation rules of the motorized equipment
  • Understanding on SMT process control, process configuration and SPC methods
  • Fresh Graduates also are encouraged to apply

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