Diploma Electronics Engineer

Job Title: Diploma Engineer (Electronics)

Location: Naraina, New Delhi

Experience: 1-3 Years

Company Overview:

Continental Device India Pvt. Ltd., (CDIL) is a pioneer and a world class Semiconductor Manufacturer of silicon chips and devices since 1964.

With 50 years of semiconductor manufacturing experience, strict standards of quality, constant improvements in R&D, technology, and processes, and the hard work of a team of dedicated professionals, CDIL today is an Indian brand that is recognized globally.

As India is poised for rapid take off and is set to become a manufacturing center for the world, we too look forward to setting new standards of excellence in electronics and introducing our range of products and services to the furthest corners of the globe.

Job Summary:

We are looking for an Electronics Diploma Engineer with 1-3 years of experience to support wire bonding machines and production operations.

The candidate will work on machine setup, operation, basic maintenance, and process adjustments. The person should be willing to learn the wire bonding process and develop good skills in machine operation and process control.

Key Responsibilities:

• Set up and adjust the wire bonding machine as required.
• Operate the machine and make sure it runs smoothly.
• Learn and understand wire bonding process, machine settings, and process controls.
• Perform regular machine checks and basic troubleshooting.
• Support daily production setup and machine requirements.
• Maintain good process quality and stability during production.
• Work with the production and engineering teams to improve the process.
• Maintain proper records of machine settings, process parameters, and machine logs.

Qualifications:

• Diploma in Electronics Engineering.
• 1-3 years of relevant hands-on experience.
• Good hands-on skills in machine setup and operation.
• Ability to learn and operate precision manufacturing machines.
• Good eyesight and attention to detail, as the work involves micro-level components.
• Basic troubleshooting and problem-solving skills.
• Willingness to learn and develop expertise in wire bonding technology.