Director, Process Support Engineer (Advanced Packaging)

About the Role

Join Applied Materials and help shape the future of semiconductor innovation through advanced packaging technologies. As a Director, Process Support Engineer, you will serve as a key technical leader, partnering with customers and internal R&D teams to drive process optimization, technology adoption, and next-generation advanced packaging solutions.

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Key Responsibilities

• Lead the resolution of highly complex customer process challenges across advanced packaging applications using systematic troubleshooting, root cause analysis, statistical methodologies, and Design of Experiments (DOE).
• Establish and drive cross-functional issue management mechanisms, coordinating resources across Business Units, Engineering, Service, Product Development, and Customer Support organizations to ensure timely resolution and knowledge sharing.
• Provide technical leadership for customer demonstrations, proof-of-concept activities, and technology evaluations, including defining process conditions, analyzing results, and presenting recommendations.
• Partner closely with strategic customers to develop and optimize advanced packaging process flows, translating customer requirements into viable technical solutions that meet performance, yield, and manufacturing objectives.
• Act as a trusted technical advisor and subject matter expert for advanced packaging technologies, including wafer-level packaging, fan-out, RDL, hybrid bonding, bumping, TSV, heterogeneous integration, and next-generation interconnect solutions.
• Collaborate with product development and engineering teams to influence product roadmaps, identify technology gaps, and drive process and hardware enhancements aligned with customer and market requirements.
• Lead technology transfer and customer enablement activities, including customized process development, process integration, qualification planning, and production ramp support.
• Build strategic partnerships with leading semiconductor manufacturers, OSATs, research institutes, and ecosystem partners to evaluate emerging technologies and accelerate adoption of new solutions.
• Drive joint development programs, beta-site evaluations, and customer collaborations focused on next-generation advanced packaging technologies.
• Represent Applied Materials at executive-level customer engagements, delivering technical presentations and influencing technology decisions at senior management levels.
• Capture and communicate customer insights, best practices, and lessons learned globally to strengthen product offerings and enhance customer success.
• Stay current with industry trends, technology roadmaps, and academic developments in advanced packaging, and contribute to industry conferences, technical publications, and professional forums.

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Preferred Qualifications

• PhD, Master's, or Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related discipline.
• 15+ years of semiconductor industry experience with deep expertise in advanced packaging process development, process integration, customer engineering, or technology pathfinding.
• Strong knowledge of packaging technologies such as Fan-Out, CoWoS, 2.5D/3D integration, RDL, TSV, hybrid bonding, electroplating, CMP, wafer-level processing, and heterogeneous integration.
• Demonstrated expertise in DOE, statistical process control, failure analysis, root cause investigation, and yield improvement.
• Experience working directly with leading foundries, OSATs, IDMs, or semiconductor equipment suppliers.
• Proven ability to influence customers and stakeholders across technical and executive levels.
• Strong leadership, communication, and cross-functional collaboration skills in a global environment.
• Experience leading strategic customer engagements, joint development programs, or technology commercialization initiatives is highly desirable.