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EFA Engineer

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Onsite

EFA Engineer

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD.

EFA Engineer

Skills

R

2 months ago

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Important information


Contract type:

Permanent

Salary:

MYR 54,000 – MYR 63,600 / year

Location:

Johor Bahru, Johor, Malaysia

Work mode:

Onsite

Published on:

4 September 2026

What they need


About the role

Lead electrical failure analysis for System-in-Package (SiP), wireless and power module products. Manage failure-analysis cases arising from R&D pilot builds, mass-production yield excursions, reliability testing and customer returns. Independently perform failure localization, root-cause analysis, corrective-action verification, FA reporting and case closure.

Key responsibilities

  • Operate EFA equipment, including oscilloscopes, EMMI, OBIRCH, TDR and I–V/C–V measurement systems
  • Diagnose SiP-related failures such as open/short circuits, leakage current, functional failures, intermittent faults, solder-joint defects and interconnection failures
  • Collaborate with the Physical Failure Analysis (PFA) team on SEM, FIB and cross-section analysis
  • Correlate electrical and physical findings to identify root causes involving product design, component materials, packaging processes and test methods
  • Drive yield improvement by analysing failure patterns, proposing practical corrective actions and working with Process, PIE, Test and R&D teams
  • Develop and optimise EFA methodologies, standard operating procedures and failure-case databases
  • Support customer FA audits, quality reviews, technical discussions and troubleshooting enquiries
  • Contribute to laboratory efficiency, technical capability development, product reliability validation and quality improvement

About you

  • Bachelor's degree or above in Microelectronics, Electronic Engineering, Semiconductor Technology, Materials Science, Automation or a related field
  • Minimum three years of hands-on EFA experience within semiconductor packaging and testing, SiP modules or a related industry
  • Strong understanding of SiP packaging processes, module construction, basic IC circuitry, FT/WAT testing and common failure mechanisms
  • Proven ability to independently investigate and close complex failure cases using appropriate EFA techniques
  • Familiarity with PFA methods and the ability to combine EFA and PFA findings for accurate root-cause determination
  • Experience in mass-production yield improvement and systematic investigation of batch-related failures
  • Strong analytical, problem-solving and cross-functional coordination skills
  • Able to prepare professional FA reports in both English and Chinese
  • Confident in supporting customer technical reviews and communicating complex findings clearly

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