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Electrical / Signal Integrity Engineer

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Onsite

Electrical / Signal Integrity Engineer

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Electrical / Signal Integrity Engineer

Skills

RADP Workforce Now

6 months ago

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Important information


Location:

Chandler, AZ, USA

Work mode:

Onsite

Published on:

20 August 2026

What they need


Working in the Pathfinding R&D department, the Sr. Electrical / Signal Integrity Engineer will develop new semiconductor test interconnect technologies as well as signal integrity analyses for customer applications.

Responsibilities

  • Meet with customers, determine technology requirements, development strategy

  • Provide design inputs and work with Design team to ensure mechanical design meets the SI requirements

  • Create Test plans, procure collaterals needed

  • Test execution (or lead the lab resources to complete tests when feasible) - run experiments to characterize or validate performance of new technology prototypes or first articles

  • Create documents (SI analysis reports, test reports, design recommendations)

  • Report results to customers, collaborate with customers to gain design approval

  • Effective technology and process handoff to Applications, Design, Manufacturing teams to enable future project success

  • Expert consultant where needed

Requirements:

BSEE or similar degree with 7+ years or MSEE with 5+ years of relevant experience, preferably in the semiconductor product design or test industry.

Basic skills

  • Test interconnect types/socket constructions

  • Tuning somewhat complex coax structures with multiple dielectric materials

  • Effects of construction/cavity design on SI

  • 3D EM SI simulation (ANSYS HFSS)

  • Spring probe and elastomer design considerations for maximizing bandwidth/minimizing crosstalk

  • Understand the requirements presented by digital interfaces such as DDR, PCIe, Ethernet, etc.

Advanced skills

  • VNA measurement techniques

  • PCB design/manufacturing methods

  • Experiment instrumentation and execution (meters and lab equipment, test methods, etc)

  • Design for manufacturing considerations related to test sockets

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