Electronic Packaging Design Engineer 2095

ARTS, part of the TSG Group, is looking for an Electronic Packaging Design Engineer to join its R&D team.

The position is based in Yavne, Israel.

Responsibilities:

• Mechanical design and electronic packaging of complex electronic systems, from concept through production.
• Design of rugged enclosures, thermal solutions, and integration of cabling and electronic circuit boards.
• Working with subcontractors and leading tasks end-to-end.

Requirements:

• At least 2 years of experience in electronic packaging design or mechanical design of electromechanical systems.
• Experience with SolidWorks and/or AutoCAD.
• Experience designing enclosures, cabling, connectors, or integrating electronic boards.
• Experience working with manufacturing teams and subcontractors.
• Ability to work independently, with strong organizational skills and attention to detail.
• Experience in the defense industry or familiarity with military standards - an advantage.