Embedded/Firmware Engineer

Job Title: Firmware Engineer Exp: 6-10 years Location: Dallas, TX (Onsite) Key skills

• OCP DC-SCM/DC-MHS, USB

• OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.

• Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.

• Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.

• OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.

• Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

6 to 10 years of experience

• Expert embedded C, strong C++
• BMC / platform-management firmware experience (OpenBMC strongly preferred)
• DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
• Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
• RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
• Yocto/BitBake, CMake/Meson, Git, CI
• Understanding of I2C/SMBus, SPI, UART, USB, GPIO
• Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics

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