Engineer, Design

Position Summary:

Amkor Technology is seeking an IC Package Design Engineer for its Tempe, Arizona location. This role is responsible for developing high-quality IC package designs, creating detailed engineering drawings, and supporting multiple design-related activities within the Design Center. The engineer collaborates with internal teams and customers to deliver package solutions that meet thermal, mechanical, electrical, and manufacturing requirements.

Essential Duties and Responsibilities:

• Design laminate (BGA) and wafer-level semiconductor packages, including determination of design rules, optimization, verification, and package selection based on thermal, mechanical, and electrical requirements.
• Create accurate and detailed engineering drawings with minimal supervision.
• Analyze and resolve design challenges and customer-related technical issues using sound engineering principles.
• Identify opportunities to improve design methodologies, processes, and technologies.
• Exercise sound judgment when making design-related decisions and recommendations.
• Build and maintain effective partnerships with customers and cross-functional teams to support quality and productivity objectives.
• Collaborate with Amkor Product Group and Sales teams to ensure customer requirements are understood and achieved.
• Interface with internal and external customers to support design reviews, technical discussions, and project execution.
• Prepare technical documentation and maintain accurate engineering records.
• Demonstrate a continuous learning mindset and contribute positively to team development and knowledge sharing.
• Perform other duties as assigned.

Required Qualifications:

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
• Experience using CAD or similar engineering software to create and maintain technical drawings.
• Strong verbal and written communication skills.
• Ability to manage multiple tasks and complete assignments effectively with minimal supervision.
• Self-motivated, detail-oriented, and able to work collaboratively in a team environment.
• Demonstrated ability to meet project deadlines and manage priorities in a fast-paced setting.

Preferred Qualifications:

• Experience in semiconductor packaging design.
• Experience using package design and simulation tools such as Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350.
• PCB design experience.
• Working knowledge of Geometric Dimensioning and Tolerancing (GD&T) practices.
• Signal Integrity (SI) and Power Integrity (PI) analysis experience.