Engineer – Equipment, Wafer Prep Engineering

Responsibilities:

• Perform routine maintenance, troubleshooting, and repair of wafer preparation equipment, including: Backgrinding Mounter machines, Laser Groove machines, Dicing Saw machines
• Ensure equipment is operating at optimal performance levels to meet production target
• Diagnose and resolve equipment malfunctions to minimize downtime
• Monitor and adjust machine parameters to maintain production quality
• Ensure optimal performance of relevant equipment systems, including sub-chuck and interval blade dressing systems for Dicing Saw machines
• Monitor and analyse wafer backgrinding, mounting, laser grooving, and dicing processes to identify areas for improvement
• Implement process control tools to enhance production efficiency and quality
• Identify opportunities to enhance equipment performance and process efficiency
• Collaborate with process engineers to develop and execute improvement projects
• Participate in continuous improvement initiatives to improve quality, delivery, and cost
• Support machine qualification and process evaluation where required
• Conduct failure analysis and troubleshooting to identify root causes of equipment and process issues
• Support the ramp-up of new devices and technologies
• Maintain safety and quality standards through regular checks and proactive issue prevention
• Provide technical guidance and training to junior engineers and technicians
• Collaborate with internal teams and external vendors to resolve equipment and production issues
• Prepare equipment and maintenance reports, communicate updates to stakeholders, and stay abreast of industry and wafer preparation technology advancements

Requirements:

• Degree in Engineering
• Relevant experience in semiconductor equipment, wafer prep engineering
• Basic knowledge of SPC (Statistical Process Control) and MSA (Measurement System Analysis)
• Knowledge of laser operation and maintenance is an advantage
• Good documentation, reporting, and communication skills