Engineer I, Process Sustaining Engineering

Job Responsibilities

• Participate and lead various yield & quality improvement programs and cost reduction activities by using 6-sigma methodologies
• Leading a of Wire Bond engineers and technicians, cross functional team.
• Provide technical consultation and guidance to ensure team success in daily tasks and projects
• Define the cutting edge of wire bond technology roadmap
• Evaluate new materials (wire), new processes, and new equipment for current and future needs.
• Work with R&D team to sets up and ramp new manufacturing processes to meet process Critical to quality requirements, CPK, full risk assessment, UPH, Yield, and cost targets to ensure ramp robustness/readiness of new products
• Work closely with product development team to understand the package design rules & requirements.

Qualifications

• Min. Bachelor’s degree in Engineering/ Applied Science/ Science.
• 0–3 years of working experience in semiconductor assembly, wire bonding, process engineering, or related manufacturing environment.
• Fresh graduates with relevant academic background and strong technical interest in semiconductor manufacturing are encouraged to apply.
• Possess good knowledge and skills in manufacturing process & equipment.
• Possess knowledge in DOE, 8D Problem Solving, FMEA, SPC, Minitab.
• Creative problem solving skill and well equipped with critical thinking & creativity to analyze and solve problem
• Team lead with effective communication and interpersonal skills