Engineer II (Phicom/Wirebond)

This is your new job:

As an Engineer II within the RTR Engineering team, you will support high-volume semiconductor manufacturing operations by driving Wire Bond equipment performance, reliability, and continuous improvement initiatives. You will collaborate with Production, Process, Quality, Manufacturing, and Maintenance teams to ensure operational excellence.

Key responsibilities include:

• Troubleshoot and resolve Wire Bond equipment issues to minimize downtime.
• Drive equipment reliability and preventive maintenance improvements.
• Support equipment qualification, validation, installation, and production ramp activities.
• Analyze OEE, yield, and downtime data to identify improvement opportunities.
• Lead equipment optimization, productivity, and cost reduction projects.
• Ensure compliance with safety, quality, and manufacturing standards.

This is you:

Education & Experience

Must Have

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering, or equivalent.

• Minimum 2-5 years of semiconductor manufacturing experience.

• Experience supporting Wire Bond equipment in a production environment.

Hard Skills

Must Have

• Wire Bond equipment troubleshooting and root cause analysis.

• Preventive maintenance and equipment reliability improvement.

• Equipment qualification, validation, and production support.

• Knowledge of OEE, MTBF, MTTR, and Yield monitoring.

Nice to Have

• Experience with ASM, K&S, Shinkawa, Hesse, or similar Wire Bond platforms.

• Knowledge of SPC, FMEA, 8D, Lean Manufacturing, or Six Sigma.

• Exposure to automation, robotics, or factory integration systems.

Soft Skills

Must Have

• Strong analytical and problem-solving skills.

• Good communication and stakeholder management.

• Ability to work independently in a fast-paced environment.

Nice to Have

• Project management skills.

• Continuous improvement mindset.

• Coaching or mentoring experience.

This is your department and colleagues:

The RTR Engineering team is responsible for improving equipment performance, reliability, productivity, and manufacturing efficiency. The team works closely with Production, Process Engineering, Quality, Manufacturing Excellence, and Maintenance teams to ensure stable operations and achieve business objectives.

This is what Nexperia offers:

• Opportunity to work within a leading global semiconductor manufacturing environment.

• Exposure to advanced manufacturing and Wire Bond technologies.

• Career development and growth opportunities.

• Competitive compensation and benefits package.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.