Engineer / Senior Engineer Reliability (Advanced Packaging Technologies / SMT)

Your role
Key responsibilities in your new role

• Define a reliability assessment plan for new package technologies using a failure mechanism-based approach and determine the technical capability of package technologies to meet specified reliability requirements, including the setup of customer mission profiles.
• Identifynew failure modes, detect unexpected results and statistical outliers, and assesspotential risks that are not covered by existing standards.
• Execute reliability stress tests and physical analyses, evaluate reliability data, and derive conclusions and recommendations.
• Participate in project discussions related to package delta analyses and risk assessments.
• Support the qualification of new packages, processes, and production changes.
• Evaluate and qualify chip embedding packages and high-density power modules for AI-applications.
• Generate and establish work-instructions for physical failure analysis.
• Make sure to follow the current and agreed reliability standards (mainly industrial).

Your profile
Qualifications and skills to help you succeed

• Minimum Bachelor's or Master's degree in Materials Science, Physics, Electrical Engineering, or Electronics Engineering.
• Minimum 1-3 year of experience in the frontend or backend semiconductor manufacturing industry. Experience in reliability and qualification activities is preferred.
• Ability to work independently, take a proactive approach, and drive value through continuous improvement initiatives.
• Strong team player with excellent communication and interpersonal skills.
• Familiarity with problem-solving techniques, statistical analysis, Failure Mode and Effects Analysis (FMEA), Python programming, and Tableau is an advantage.
• Experience in advanced packaging technologies (e.g., chip embedding) or Surface Mount Technology (SMT) is an added advantage.