Achieve Group
Engineering Director (Advanced Semiconductor Packaging)
Skills
12 days ago
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Important information
Contract type:
Permanent
Work mode:
Onsite
Published on:
12 October 2026
What they need
The role
- Reports to the BU General Manager
- Lead multi-discipline teams: process, mechanical, electrical and controls, software, optics and metrology, systems and lab
- Own system architecture and the placement and overlay error budget, from concept through to a qualified tool at customer sites
- Set the alignment strategy, including camera architecture, mark design rules, calibration and closed-loop overlay correction
- Run phase-gated development: design reviews, FMEA, requirements traceability, configuration control
- Manage engineering budget, schedule, technical risk and make-vs-buy decisions
- Work with Applications, Quality and Operations on tool qualification, SEMI S2/S8 compliance and transfer to manufacturing
- Set the roadmap toward finer pitch and tighter overlay, and build the BU’s IP portfolio
- Hire and develop senior specialists in bond head, motion, optics, vision and equipment software
What you bring
- MS or PhD in mechanical, electrical, mechatronics or optical engineering, or physics
- 15+ years in semiconductor capital equipment, including 7+ years leading multi-discipline engineering teams
- Delivered at least one precision placement, bonding, lithography or metrology tool from concept to customer acceptance
- Deep expertise in sub-micron optical alignment and error budgeting
- Strong grounding in precision motion control, thermal and vibration management, and machine vision
- Working knowledge of die placement and bonding (hybrid bonding, TCB, flip-chip)
- Track record of hiring, developing and retaining senior technical talent
Good to have
- Direct experience with hybrid bonding, TCB or flip-chip bonders, or wafer-to-wafer aligners
- Patents or publications in alignment optics, precision motion or bonding
- Experience qualifying tools with foundries, IDMs or OSATs
How To Apply:
Interested candidate, please submit your updated resume in MS WORD Format to Terry Ng, email – [email protected]
EA Personnel Reg. No. R1107654, Achieve Career Consultant Pte Ltd EA Licence No. 05C3451
We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.
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