Engineering Hiring – Multiple Positions

We are expanding our Engineering team and are looking for talented professionals to join our semiconductor manufacturing operation. If you are passionate about process improvement, automation, product quality, and advanced manufacturing technologies, we would like to hear from you.

Open Positions

• AOI Process Engineer
• DA (Die Attach) Engineer
• Assembly Engineer
• Test Engineer
• Failure Analysis (FA) Engineer
• Internal Discipline Auditor
• Active Alignment Engineer

Position Overview Active Alignment Engineer

Responsible for machine setup and buy-off, MOI management, process optimization, defect reduction, yield improvement, productivity enhancement, and NPI/production readiness support.

Preferred Experience

• Active Alignment (AA)
• Optical Test
• Semiconductor / Optical / Transceiver Manufacturing
• Process Engineering / NPI
• Quality Control / 7QC Tools
• Lean / Six Sigma

AOI Process Engineer

Responsible for developing and optimizing AOI inspection programs, recipes, and inspection standards. Improve inspection performance, analyze defect trends, reduce false calls, support machine qualification, and collaborate with cross-functional teams to enhance product quality and manufacturing efficiency.

Preferred Experience

• AOI / Machine Vision / Image Processing
• Die Bond / Wire Bond / Semiconductor Backend Process
• Process Improvement & Root Cause Analysis

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DA (Die Attach) Engineer

Responsible for process optimization, yield improvement, equipment qualification, NPI support, process validation, and continuous improvement of Die Attach manufacturing processes.

Preferred Experience

• Die Attach (DA)
• Wire Bond (WB)
• Semiconductor Manufacturing
• Process Engineering

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Assembly Engineer

Responsible for assembly process development, fixture design, glue dispensing process, NPI support, yield improvement, and continuous improvement activities for optical transceiver manufacturing.

Preferred Experience

• Assembly Process
• Glue Dispensing
• Assembly Fixture Design
• NPI / HVM
• Yield Improvement

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Test Engineer

Responsible for Automatic Test System (ATS), test program development, test hardware/software improvement, debugging, test automation, and manufacturing test optimization.

Preferred Experience

• Automatic Test System (ATS)
• Functional Test
• Test Software & Hardware
• Test Script Development
• Automation

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Failure Analysis (FA) Engineer

Responsible for product failure analysis, root cause investigation, debug support, RMA investigation, 8D reports, PFMEA updates, and supporting product reliability improvement.

Preferred Experience

• Failure Analysis (FA)
• RMA
• MRB
• 8D Report
• Test Debug
• Root Cause Analysis

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Internal Discipline Auditor

Responsible for conducting manufacturing process audits, identifying operational risks, supporting lean manufacturing initiatives, coordinating with overseas customers, and driving continuous process improvements.

Preferred Experience

• Quality Engineering
• Internal Audit
• Lean Manufacturing
• Process Audit
• Quality System

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General Qualifications

• Bachelor's degree or above in Engineering or a related field (Electronics, Electrical, Mechanical, Mechatronics, Industrial, Computer, Software, Production Engineering, etc.).
• Experience in electronics, semiconductor, optical transceiver, or related manufacturing industries.
• Fresh graduates are welcome to apply for selected positions (especially DA Engineer).
• Experience in AOI, Die Attach (DA), Wire Bond (WB), Assembly, Test, Failure Analysis, or Manufacturing Process Engineering is highly preferred.
• Good analytical, troubleshooting, and problem-solving skills.
• Experience in NPI, HVM, Yield Improvement, Root Cause Analysis, Process Optimization, or Continuous Improvement is an advantage.
• Good command of English. Chinese language skills will be an advantage.
• Good communication, teamwork, and interpersonal skills.
• Proficient in Microsoft Office applications (Excel, Word, PowerPoint).