Engineer/Senior Engineer (NPI)

About Stats ChipPAC

At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow’s technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.

What You’ll Do

As an NPI Engineer, you will play a key role in managing the NPI pipeline, bringing new products from Concept to Mass Production. Your responsibilities will include:

Lead and drive NPI activities, develop timelines and monitor progress to ensure timely product launches.

Design for Manufacturability (DFM), using Advanced Product Quality Planning (APQP) as the backbone to Minimize Risks, improve Product Quality, and enhance Customer Satisfaction.

Work with internal / external customers to develop essential BOMs, Process flows, Control Plans, FMEAs, Statistical Process Control (SPC), and Quality Control Measures to ensure products meet Customer Requirements.

Identify opportunities for Continuous Improvement, propose and implement changes to enhance efficiency on Quality, Yield and Costs.

Collaborate with cross functional teams to ensure a smooth product launch and successful transition.

What we’re looking for

Degree in Engineering.

(Electrical, Electronics, Mechanical, Mechatronics, or related fields)

2–5 years of experience in NPI, Program Management, Process engineering or related fields.

Hands-on, analytical, and passionate about problem solving.

Good teamwork, communication, and project management skills.

Comfortable working in a cleanroom and fast-paced production environment.

Join a leader in the industry!

STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.

Join us and expand your world.