EOL Package SAW Engineer (Dicing & Singulation)

Company Overview

Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies . Operating a premier semiconductor manufacturing complex in Melaka, the site handles complex back-end wafer processing, assembly, package singulation, and final test operations. To strengthen technical authority across its dicing and package singulation lines, the EOL Engineering team is recruiting a Senior EOL Package SAW Engineer .

Position Overview

Reporting to the EOL Section Manager , the EOL Package SAW Engineer serves as the primary technical specialist for End-of-Line mechanical dicing, wafer sawing, and package singulation. This senior individual contributor role owns process parameter development, diamond blade saw optimization, and defect reduction across high-precision dicing platforms.

Key Responsibilities

1. Process Ownership & Dicing Parameter Optimization

• Own and drive End-of-Line (EOL) wafer mechanical sawing, package dicing, and singulation process engineering.
• Optimize diamond blade parameters—including spindle RPM, feed rates, cut depth, dress parameters, and cooling water nozzle flow dynamics—to eliminate top/backside die chipping, micro-cracks, and sidewall delamination.
• Manage dicing tape selections, UV-release tape irradiation parameters, frame lamination tension, and kerf width controls.

2. Equipment Platform Management & NPI Qualification

• Drive continuous equipment performance optimization on high-precision dicing platforms (e.g., DISCO DAD, ACCRETECH/TSK, K&S).
• Establish robust SPC controls, line qualification standards, and root-cause containment protocols for new package introductions and thin-wafer singulation.
• Conduct blade life evaluations, cost-down initiatives, and yield improvement programs.

Requirements

• Education: Bachelor’s Degree in Mechanical, Microelectronics, Manufacturing, or Materials Engineering.
• Work Experience: 8 to 10 years of dedicated semiconductor back-end dicing, wafer sawing, and package singulation experience.
• Domain Expertise: Expert-level, hands-on experience with mechanical diamond blade dicing equipment platforms (DISCO/TSK systems) and dicing/UV tape material interactions.
• Technical Proficiency: Deep knowledge of silicon micro-cracking mechanisms, blade wear dynamics, kerf alignment verification, and SPC methodology.