Equipment & Process Engineer (Plating)

About the role

We are looking for Equipment & Process Engineer (Plating) to support and drive high-performance BIM (RTR) plating operations in a high-volume semiconductor manufacturing environment. This role is critical for sustaining process stability, improving yield, and supporting the introduction of new technologies into High Volume Manufacturing (HVM).

Key responsibilities

• Own and sustain BIM (RTR) plating processes and equipment to ensure stable, high-yield manufacturing
• Drive continuous improvement initiatives focused on yield, quality, throughput (UPH), and cost reduction
• Identify and eliminate process variations using structured engineering and data-driven analysis
• Lead Lot-On-Hold (LOH) disposition and provide strong floor support to manufacturing operations
• Collaborate with Equipment, R&D, NPI, QA, and Product teams for new product and process qualification
• Support the smooth transfer of new technologies, chemicals, processes, and equipment into HVM
• Maintain and update technical documentation, including SOPs, control plans, FMEAs, and process specifications
• Coordinate with suppliers on plating equipment, chemicals, jigs, fixtures, and spare parts
• Mentor technicians and support 24/7 operations through effective task planning and coverage
• Ensure full compliance with EHS and chemical handling standards

About you

• Bachelor's degree in engineering (Chemical Engineering preferred)
• Minimum 5 years of semiconductor manufacturing experience, with at least 3 years in plating or wet processes
• Hands-on experience with semiconductor plating equipment; experience with MECO plating lines is a plus
• Strong knowledge of plating process fundamentals, chemical interactions, and defect troubleshooting
• Proficiency with statistical analysis tools such as JMP or Minitab
• Excellent technical documentation, communication, and cross-functional collaboration skills
• Ability to perform effectively in a fast-paced, high-volume manufacturing environment
• Experience with BIM / RTR plating lines is preferred
• Exposure to advanced packaging technologies is a plus
• Proven track record in yield improvement and process optimization projects is highly desirable