Equipment Engineer (Assembly)

Minimum Qualifications

• Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics Engineering, or a related engineering field.
• 1–3 years of relevant experience in power semiconductor discrete or power module assembly, automated manufacturing, or OSAT equipment engineering and maintenance.
• Working knowledge of electrical, mechanical, pneumatic, and PLC-controlled systems.
• Strong troubleshooting, problem-solving, and analytical skills.
• Hands-on experience or familiarity with semiconductor assembly equipment such as:

Die Attach / Sintering Equipment, Wire or Ribbon Bonders, Mold Press Systems, Vacuum Reflow Systems, Laser Marking and Singulation Equipment, Vision Inspection Systems

• Knowledge of OEE, TPM, FMEA, and statistical analysis.
• Basic PLC programming or automation experience is an advantage.

Key Responsibilities

• Ensure high equipment uptime and reliability through effective preventive and corrective maintenance programs.
• Troubleshoot equipment-related issues and drive root cause analysis and corrective actions.
• Lead equipment installation, qualification, validation, and release for production use.
• Develop, implement, and optimize maintenance procedures, preventive maintenance schedules, and spare parts management.
• Collaborate with Process, Production, and Quality teams to improve equipment performance, productivity, and yield.
• Monitor and analyze key equipment performance indicators, including OEE, MTBF, and MTTR.
• Support automation and continuous improvement initiatives to enhance productivity, equipment efficiency, and cost effectiveness.
• Coordinate with equipment suppliers and service providers for technical support, troubleshooting, upgrades, and equipment improvements.