Equipment Engineer (Back End) / Die Bond Process Engineer

Job Title: Process Engineer

Department: Micro-E / Product Engineering

Position Responsibilities:

• Lead production in building new products requiring Micro-Electronics, specifically Die Bond and Wire Bond, and Mechanical assembly.
• Create, review, and update work instructions, specifications, process control plans, and routings (PFS).
• Generate and review Engineering Change Orders (ECOs) related to form, fit, function, and assembly of products.
• Review Micro-E raw material FA reports and perform form, fit, and function tests as required by SOP.
• Conduct Design for Manufacturing (DFM) studies on new products.
• Conduct Design of Experiments (DOE) and Failure Modes and Effects Analysis (FMEA) to optimize manufacturing processes.
• Introduce process control procedures/systems and analyze statistical data for improvement action plans.
• Audit production lines to identify non-conforming practices and tools needing correction.
• Conduct line balancing with Industrial Engineering (IE) to improve throughput.
• Review yields and quality reports, and implement corrective actions to improve yields.
• Perform continuous process improvement by introducing new materials, processes, tools, and jigs/fixtures.
• Recommend procurement and use of tools and equipment necessary for product assembly.
• Determine required labor time for manufactured products and validate standards regularly.
• Provide assembly quotations when required.
• Train other employees as needed.
• Correspond with customers regarding technical issues and concerns related to assembly processes.
• Work with customer representatives during visits and/or onsite customer interactions.

Qualifications:

✅ 5-7 years of experience in Micro Electronics Assembly processes, knowledgeable in automatic machine setup for Die Bond (epoxy and eutectic processes) and Wire Bond (Aluminum and Gold Wire).

✅ BS degree in Electronics and Communication Engineering, Computer Engineering, Electrical Engineering, Industrial Engineering, Physics, or related field.

✅ Proficiency in Microsoft Office (Word, Excel, PowerPoint, Outlook).

✅ Knowledge of statistical tools for manufacturing.

✅ Leadership and coordination skills.

✅ Good English communication skills.

Job Title: Equipment Engineer (Back End)

Department: Equipment Engineering

Position Responsibilities:

• Lead maintenance activities for Back End equipment including:

  • Selective Soldering
  • Wave Soldering
  • Aqueous Cleaning
  • Depanel Machines
  • Ovens
  • Conveyors
  • Press-Fit Equipment
  • Rework Stations

• Drive preventive, corrective, breakdown, and predictive maintenance programs.

• Analyze equipment issues and implement solutions to minimize downtime.

• Lead and develop technicians through coaching, training, and performance management.

• Support production, NPI, process troubleshooting, validation, and continuous improvement initiatives.

• Develop and maintain maintenance procedures in compliance with ISO13485, IATF16949, AS9000, FDA, and other industry standards.

• Create and optimize soldering profiles and machine programs for manufacturing processes.

• Collaborate with cross-functional teams to improve quality, productivity, and operational efficiency.

• Support audits, Kaizen activities, Lean initiatives, and cost-saving projects.

Qualifications

✅ Bachelor's Degree in Electrical, Electronics, Mechatronics, Mechanical Engineering, or related fields

✅ Experience:

• Senior Engineer: 5+ years in equipment maintenance or manufacturing engineering
• Experience in Electronics Manufacturing Services (EMS) or Contract Manufacturing is highly preferred

✅ Technical Knowledge:

• Equipment maintenance and troubleshooting
• Wave Soldering and Selective Soldering processes
• Preventive Maintenance (PM), Corrective Maintenance (CM), and Predictive Maintenance
• Manufacturing process improvement and root cause analysis

✅ Skills:

• Good command of English
• Strong problem-solving and analytical skills
• Leadership and team development capability
• Good interpersonal and communication skills

Work Environment:

• 5-day work week, 8:00 AM – 5:00 PM (with occasional OT).
• Clean, air-conditioned factory environment.
• American corporate culture with a results-oriented approach.
• Direct reporting to the Manager.
• Provident Fund / Incentive Allowance

The Human Resources Department
Benchmark Electronics (Thailand) Public Company Limited
Ayudhaya  Address : 94 Moo 1, Hi Tech Industrial Estate, Banlane, Bang Pa-In, Ayudhaya 13160
Tel. (035) 276-300 ext. 2010 276-300 ext. 2010) Fax : [( 035 ) 276-399](tel:( 035 ) 276-399)