Equipment Engineer – Bumping

About the role

To manage, operate, and maintain all core Bumping process equipment and associated utility interfaces to ensure maximum tool availability and operational stability. To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for Bumping line equipment, leveraging a comprehensive technical understanding of full-line bumping operations.

Key responsibilities

• Bumping Line Equipment & Utility Operation
• Preventive Maintenance (PM) & Unplanned Breakdown Troubleshooting
• Tool Hook-up, Setup & New Equipment Qualification
• Equipment OEE Optimization & Spare Parts Management
• Bumping Process Tool Failure Analysis (FA) & Yield Support
• Equipment & Facility Vendor Technical Support Management

About you

• Bachelor's degree or higher in Mechanical Engineering, Electrical/Electronic Engineering, Chemical Engineering, Material Science, or related disciplines
• R&D or mass production experience of at least eight years in semiconductor equipment engineering, specifically in Bumping, MEOL, or 2.5D/3D advanced packaging (CoW)
• Proven experience in leading and managing engineering teams, allocating resources, and overseeing daily line/equipment operations
• In-depth technical knowledge of semiconductor equipment setup, hook-up, preventive maintenance (PM), and utility infrastructure (e.g., gases, chemicals, DI water, vacuum)
• Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification
• Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams
• Proficiency in technical documentation and reading/writing/presenting in English for senior management and customer interactions