Equipment Engineer – CoW

About the role

To oversee, maintain, and optimize all core Chip-on-Wafer (CoW) line equipment and associated utility interfaces to ensure maximum tool availability, process stability, and high operational yield. To lead routine/advanced preventive maintenance (PM), resolve critical equipment breakdowns, and drive tool qualification/hook-up for CoW line equipment, leveraging 10+ years of deep technical expertise in advanced 2.5D/3D packaging equipment.

Key responsibilities

• Full-line CoW Equipment & Utility Maintenance Management (e.g., TCB, Flip Chip Bonder, CMP, Dicing, Cleansing)
• Advanced Troubleshooting, Root-Cause Failure Analysis & Preventive Maintenance (PM) Optimization
• New Tool Hook-up, Setup, Buy-off & High-Precision Calibration (Sub-micron Alignment)
• Tool OEE (Overall Equipment Effectiveness) Optimization, Unplanned Downtime Reduction & Spare Parts Inventory Control
• Collaboration with Process & R&D Engineers to Resolve Yield Issues and Ensure Line Stability
• Equipment Vendor Technical Management, Tool Specification Review & Escalation Handling

About you

• Bachelor's degree in Mechanical Engineering, Electrical/Electronic Engineering, Material Science, or related engineering disciplines (or Diploma with equivalent extensive industry experience)
• Minimum 8 to 10 years of hands-on equipment engineering experience in semiconductor packaging, specifically in CoW, 2.5D/3D stacking, or Advanced Flip-Chip lines
• Deep technical expertise in high-precision bonding equipment (TCB, FCB), dicing, CMP, or thin-wafer handling systems
• Proven track record in equipment setup, utility hook-up (vacuum, CDA, ultra-pure water, specialty gases), and tool qualification for mass production/R&D
• Strong analytical and problem-solving skills for complex equipment failure modes (FA), thermal-mechanical behavior, and yield enhancement
• Excellent vendor management capability to direct equipment suppliers for technical modifications, tool upgrades, and escalation resolution
• Strong communication skills in English for technical reporting, cross-functional collaboration, and vendor negotiations