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Equipment Engineer (Die Prep/Surface Mount Technology)

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Onsite

Equipment Engineer (Die Prep/Surface Mount Technology)

TF-AMD Penang

Equipment Engineer (Die Prep/Surface Mount Technology)

Skills

Risk Management

16 days ago

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Important information


Contract type:

Permanent

Location:

Bayan Lepas, Penang, Malaysia

Work mode:

Onsite

Published on:

12 October 2026

What they need


  • Managing the Assembly Engineering machine related to:
  1. Die Prep (Backgrind, Laser, Sawing/Dicing, Pick & Place, 2nd Opt)

  2. FOL (SMT, Solder Paste Printing, Chip Cap Attach, Fluxer, Reflow Oven, Flux Clean)

  • Lead in project management and ensure all requirements in the development or improvement of equipment for processor functional tests are met.
  • Ensure equipment operation procedures and maintenance programs are in place.
  • Drive improvements, initiate problem-solving and develop creative engineering solutions to achieve low cost, better quality, improved capabilities, and higher efficiency,
  • Ensure timely execution of new product or process development and qualification. Demonstrates discipline in the timely execution of tasks.
  • Manage/audit/liaise with suppliers and vendors to achieve quality, cost and risk management requirements. Plan and manage budgets as well as support capital planning and cost reduction initiatives.
  • Ensure training and troubleshooting programs on equipment and hardware are in place.
  • Ensure all requirements are met for smooth equipment implementation in production.
  • Ensure expectations on production yield, quality, utilization, and cost reduction are met consistently.
  • Lead, train, and manage a team of equipment/engineering personnel. Enable and manage engineering change control activities.
  • Work closely with other TF AMD groups and sites to provide effective solutions and support for daily production activities. Demonstrates flexibility/adaptability to frequent changes.
  • Other duties as assigned by supervisor.

Job Requirements and Must Have:

  • Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics
  • At least 4-6 years and above of industrial experience in equipment development or equipment maintenance experience.
  • Good knowledge of Electronic, Electrical or Mechanical Engineering.
  • Basic understanding of semiconductor assembly.
  • Basic equipment operation and maintenance.
  • Help build and maintain effective teams.
  • Independent, resourceful and takes initiative.
  • Fresh Graduate encouraged to apply.

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