Equipment Maintenance Section Head – Semiconductor (Backgrind / Wafer Prep)

Main Job Responsibilities

1. Plan and coordinate daily maintenance activities to ensure smooth operation of all manufacturing equipment.
2. Supervise and train a team of maintenance technicians.
3. Plan and coordinate with the respective personnel on periodic preventive maintenance of all equipment and troubleshoot on equipment upgrading and modification.
4. Monitor and follow up to ensure equipment are properly setup and buyoff before assigning to production.
5. Control monitor usage and ensure sufficient supply of spare parts to prevent unnecessary machine downtime.
6. Ensure all manufacturing equipment / measuring instruments are calibrated.
7. Quality accountability:

(i)      Enforce compliance to standard operating procedures and specifications.

(ii)     Verify and recapture abnormalities/defects.

(iii)    Address or escalate subordinate feedback.

(iv)    Execute, monitor, track and follow up changes / quality performance.

(v)     Communicate quality alerts to operators / technicians / quality assurance and pass information to other shifts.

Qualifications & Requirements

1. Degree in Mechatronic/Engineering or equivalent and with related working experience.
2. Experience with Backgrind & FOL equipment (Taper, Grinder, Polisher, Detaper, Inline machine, auto mounter (Dicing tape / DAF tape), Taiko wafer ring removal, wafer sawing, 2nd opr AOI, etc)