Equipment Technician (Die Prep/Surface Mount Technology)

Job Responsibilities:

Managing the Assembly Engineering machine related to:

1. Die Prep (Backgrind, Laser, Sawing/Dicing, Pick & Place, 2nd Opt
2. FOL (SMT, Solder Paste Printing, Chip Cap Attach, Fluxer, Reflow Oven, Flux Clean)
3. MOL/EOL (Dispenser, Reflow Oven, Lid/Stiffener Attach, Ball Mount, Indium Attach, Fluxer)
4. Production line equipment maintenance on shift to meet planned KPIs goal.
5. Execute exactly according to Spec, WI, OPL and BKM to maintain equipment.
6. Equipment ramp up and conversion to support production volume loading.
7. Perform PM / CAL of production equipment.
8. Provide technical support / solutions to resolve equipment and hardware related issues.
9. Conduct Training on equipment operation and maintenance to operator and technician.
10. Meet all company requirements on 5s, quality, EHS and discipline.
11. Perform other duties as required assigned by supervisor.

Job Qualifications:

1. Education: Diploma and major in Mechanical, Electrical, Electronics, Mechatronics or etc
2. .Language: Basic English reading and writing abilit
3. yExperience: At least 5 years’ industrial experience with 2 years equipment development or equipment maintenance experienc
4. eStrong knowledge in WAFER MOUNTING, WAFER DICING, WIRE BONDING & DIE ATTACH
5. .Familiar with equipment operation and know basic maintenance of production equipment
6. .Basic communication skill and good learning and feedback ability
7. .Able to relocate and work in Batu Kawan/Bayan Lepas/Seberang Perai

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