External Manufacturing NPI Manager

Job Summary

The Senior Manager External Manufacturing NPI is responsible for leading and driving New Product Introduction (NPI) programs across external manufacturing partners from concept development through qualification, industrialization, and successful high-volume production (HVM) ramp. This role provides strategic and technical leadership to a team of NPI and process engineers while collaborating closely with internal stakeholders and OSAT partners to ensure timely product commercialization, manufacturing readiness, and operational excellence. The incumbent will play a key role in advancing technology roadmaps, enhancing manufacturing competitiveness, and delivering business growth through innovation, data-driven decision-making, and continuous improvement.

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Job Description

Leadership & Organization Management

• Lead, develop, and mentor a team of NPI and process engineers to achieve organizational objectives and business priorities.
• Drive resource planning, project prioritization, talent development, and overall team performance.
• Foster a culture of innovation, technical excellence, collaboration, and continuous improvement.

New Product Introduction (NPI) Management

• Lead backend external manufacturing NPI programs from concept development through qualification, industrialization, and production release.
• Ensure successful execution of Product Lifecycle Management (PLM) requirements to support new product commercialization.
• Drive cross-functional alignment to meet product cost, quality, reliability, and schedule targets.

Cross-Functional Collaboration

• Provide functional leadership across Business Units, Central Engineering, Operations, Quality, Supply Chain, Procurement, and external manufacturing partners.
• Facilitate decision-making, risk management, and issue resolution to ensure program success and on-time market introduction.
• Build and maintain strong strategic relationships with OSAT partners and suppliers.

Manufacturing & Technology Readiness

• Drive Design for Manufacturability (DFM) initiatives and assess technology readiness for new package platforms and derivative products.
• Ensure effective process development, manufacturability assessment, process characterization, and qualification readiness.
• Lead risk identification, mitigation planning, and qualification activities to support first silicon and first product release.

Production Ramp & Operational Excellence

• Lead production safe launch and volume ramp activities, ensuring smooth transition from development to high-volume manufacturing.
• Provide technical leadership in resolving manufacturing issues and improving yield, quality, cycle time, and productivity.
• Establish production baselines and continuous improvement programs to optimize manufacturing performance.

Technology Development & Innovation

• Collaborate with internal and external stakeholders on technology pathfinding, package roadmap development, and next-generation manufacturing solutions.
• Support the development of packaging design guidelines, manufacturing standards, and technology strategies.

Data Analytics & Best Practices

• Champion data-driven decision-making through the use of statistical methodologies, process analytics, and digital engineering tools.
• Develop and implement Best Known Methods (BKM), engineering standards, and best-in-class manufacturing practices across manufacturing sites and partners.

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Requirements

Education

• Bachelor's Degree in Engineering, Materials Science, Semiconductor Technology, or a related technical discipline.
• Master's Degree or advanced technical qualification is an advantage.

Experience

• Minimum 10 years of semiconductor backend manufacturing experience with strong expertise in assembly processes and manufacturing operations.
• Proven experience leading New Product Introduction (NPI), technology transfer, product industrialization, and production ramp activities.
• Demonstrated success in managing multidisciplinary engineering teams and complex cross-functional projects.
• Experience leading and developing teams of 10 or more engineers in a matrix organization.

Technical Knowledge

• Strong understanding of semiconductor assembly processes, packaging technologies, and manufacturing operations.
• Hands-on experience with advanced technologies such as SiC, GaN, JFET, CIS Imaging, or similar leading-edge semiconductor platforms is highly desirable.
• Knowledge of Chip-to-Package Interaction (CPI), product and process integration, and technology qualification methodologies.
• Familiarity with IC package design, CAD tools, simulation techniques, reliability characterization, and package performance analysis is advantageous.
• Solid understanding of Design of Experiments (DOE), Statistical Process Control (SPC), failure analysis, yield improvement, and risk management methodologies.

Leadership & Business Skills

• Strong leadership, stakeholder management, and project management capabilities.
• Ability to influence and collaborate effectively across multiple functions, organizations, and external partners.
• Strong strategic thinking, problem-solving, and decision-making skills.
• Proven ability to drive organizational change and operational excellence initiatives.

Communication

• Excellent verbal and written communication skills in English.
• Mandarin language proficiency is an added advantage for engagement with regional suppliers and manufacturing partners.
• Strong presentation and stakeholder engagement skills with the ability to communicate effectively at all levels of the organization.

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Additional Information

Working Hours:

Normal Hours:

Monday to Friday: 8.00am – 5.00pm (Please observe your location working hours)

Shift Structure:

Periodically rotating shift structure.

Shift working schedule: Day Shift: 6.00am – 6.00pm/Night Shift: 6.00pm –6.00am

Annual Leave:

Years of Service From 1-1.9 years, Annual Leave 13 working days

Years of Service From 2-4.9years, Annual Leave 15 working days

From 5 – 9.9 years 19 working days

From 10 -14.9 years 21working days

From 15 years and above 22 working days

Overtime Rate:

For Job Grades MY2 to MY9 (shift employee or employee with a basic salary RM4,000 and below) you will be eligible to claim overtime as follows:

 For overtime on Ordinary Working Day and/or Off Day: You shall be paid at a rate of one and a half (1.5) times the hourly rate of pay.

 For overtime on Rest Day and Public Holiday: you shall be paid a minimum of two (2) times the hourly rate of pay.

To report a concern, visit ethics.onsemi.com or contact onsemi Helpline at [1800 81 9976](tel:1800 81 9976) anonymously.