NXP Semiconductors
External Package Innovation Engineer
Skills
1 month ago
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Important information
Contract type:
Permanent
Location:
Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
Work mode:
Onsite
Published on:
17 September 2026
What they need
Hiring: External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.
🔹 Role Overview As an EPI engineer , you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.
🔹 Key Responsibilities ✅ 1. Role Owner (Strategic & Governance)
Own and lead OSAT-wide and cross-OSAT initiatives
Define and deploy standard development templates and success criteria across OSATs
Drive deployment of Best Known Methods (BKM) and lessons learned
Develop and maintain technology roadmap and capability assessment for each OSAT site
Provide Package Innovation (PI) input for:
External site sourcing strategy
Site selection process (jointly with interface manager)
Lead project governance, including:
Overall project summaries
Stoplight reporting
Regular reviews per OSAT site
✅ 2. Supporter (Execution & Project Delivery)
Support NPI & NTI projects executed at external OSAT factories
Ensure OSAT compliance with:
Development processes
Required documentation/templates
Drive alignment on SME (Subject Matter Expert) assignment at OSAT
Support and resolve technical and project issues on-site and across time zones
Ensure assembly readiness and safe production launch
🔹 Stakeholder Collaboration You Will Work Closely With Cross-functional Teams, Including
- Project Leaders & Development Managers
- Designers & Materials Engineers
- Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
- API and WLP/PLP/FC SMEs
- OSAT partners
🔹 What We’re Looking For
- Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving
🌟 Why Join Us
- Opportunity to lead high-impact package innovation initiatives
- Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive technology roadmap and next-generation packaging solutions
More information about NXP in Malaysia...
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