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External Package Innovation Engineer

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Onsite

External Package Innovation Engineer

NXP Semiconductors

External Package Innovation Engineer

Skills

Compliance

1 month ago

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Important information


Contract type:

Permanent

Location:

Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia

Work mode:

Onsite

Published on:

17 September 2026

What they need


Hiring: External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

🔹 Role Overview As an EPI engineer , you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.

🔹 Key Responsibilities ✅ 1. Role Owner (Strategic & Governance)

  • Own and lead OSAT-wide and cross-OSAT initiatives

  • Define and deploy standard development templates and success criteria across OSATs

  • Drive deployment of Best Known Methods (BKM) and lessons learned

  • Develop and maintain technology roadmap and capability assessment for each OSAT site

  • Provide Package Innovation (PI) input for:

  • External site sourcing strategy

  • Site selection process (jointly with interface manager)

  • Lead project governance, including:

  • Overall project summaries

  • Stoplight reporting

  • Regular reviews per OSAT site

✅ 2. Supporter (Execution & Project Delivery)

  • Support NPI & NTI projects executed at external OSAT factories

  • Ensure OSAT compliance with:

  • Development processes

  • Required documentation/templates

  • Drive alignment on SME (Subject Matter Expert) assignment at OSAT

  • Support and resolve technical and project issues on-site and across time zones

  • Ensure assembly readiness and safe production launch

🔹 Stakeholder Collaboration You Will Work Closely With Cross-functional Teams, Including

  • Project Leaders & Development Managers
  • Designers & Materials Engineers
  • Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
  • API and WLP/PLP/FC SMEs
  • OSAT partners

🔹 What We’re Looking For

  • Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
  • Proven ability to manage cross-site, cross-functional projects
  • Solid understanding of NPI/NTI development flows
  • Excellent stakeholder management and communication skills
  • Ability to drive standardization, governance, and technical problem-solving

🌟 Why Join Us

  • Opportunity to lead high-impact package innovation initiatives
  • Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
  • Drive technology roadmap and next-generation packaging solutions

More information about NXP in Malaysia...

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