Failure analysis Engineer - Night Shift

About the role

The position focuses on the failure analysis of advanced microprocessors and graphics processors based on 3nm FINFET and below technologies.

Key responsibilities

• Perform comprehensive failure analysis including transistor nano-probing, electrical characterization using AFM, Electron Microscopy and Material Analysis
• Perform advanced sample preparation for SoIC and other heterogeneous integration products, including planar, cross-sectional and site-specific preparation
• Prepare high-quality site-specific TEM lamellae using focused ion beam techniques for structural, material, interface, and defect characterization
• Conduct plasma FIB sample preparation and yield failure analysis on advanced products, including large-volume material removal, defect localization, cross-sectioning, and preparation for downstream analytical techniques
• Follow laboratory safety, EHS, operating procedures, and quality requirements, particularly when operating high-energy beam systems and handling chemicals during night shifts
• Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time

About you

• B.Eng in Electrical Engineering, Microelectronics, Materials Engineering and related fields
• Fundamental understanding of device physics
• Strong background in semiconductor wafer processing and materials characterization
• Ability to perform basic tool troubleshooting and interact with vendor to resolve tool issues
• Experience in fabless semiconductor and wafer fabs
• Able to work in 12hrs alternate 4days / 3days night shift
• Preferable to have mentored / managed junior engineers, associate engineers & technicians