Failure Analysis Technician (Flex PTP)

• Perform failure analysis through visual inspection using X‑ray systems, optical microscopes, and high‑resolution analytical equipment such as Scanning Electron Microscopy (SEM).
• Perform material compositional analysis using SEM and Energy Dispersive X‑ray Spectroscopy (EDX) to identify material composition and elemental distribution.
• Carry out destructive analysis methodologies such as cross‑sectioning, decapsulation, and Dye & Pry to evaluate internal component structures.
• Execute electrical testing and measurements on electrical and electronic components to verify compliance with specifications.
• Perform component testing and evaluation, including Force Test, Push/Pull Test, Drop Test, and Environmental Tests.
• Prepare, analyze, and compile test results, measurement data, and technical reports for internal teams or customers.
• Assist in Failure Analysis (FA) laboratory operations, continuous improvement initiatives, and process enhancement activities.

JOB REQUIREMENTS
· Able to perform soldering of PCBA chip components and troubleshooting.
· Ability to read schematic diagrams and basic mechanical drawings.
· Keen interest in learning and exploring equipment and technology.
· Good communication skills and able to interact with all levels of personnel.