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Field Application Engineer

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Onsite

Field Application Engineer

XingR Technologies (M) Sdn Bhd

Field Application Engineer

Skills

Node

14 days ago

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Important information


Contract type:

Permanent

Location:

Bayan Lepas, Penang, Malaysia

Work mode:

Onsite

Published on:

6 October 2026

What they need


  • Customer & Technical Support.
  • Provide on-site technical support for probe card installation, setup, and debugging.
  • Support (Internal & externa) for products qualification, NPI, and production ramp.
  • Work directly with customer Test, Process, and Equipment Engineers.
  • Coordinate debug cycles, FA and corrective actions with internal engineering team.
  • Support technical proposals, RFQs, and feasibility discussions (Internal & external).
  • Identify upsell opportunities (spare, re-builds, upgrades, new platforms).
  • Provide technical justification to secure design-in and long-term supply.
  • Prepare technical reports, FA summaries, and work closely with sales for customer presentations.
  • Collect customer feedback on test challenges, roadmap, and technology trends.
  • Provide market intelligence to HQ on new nodes, packaging trends, and test demands.

Competencies:

  • Basic understanding of wafer probe / wafer sort processes.

  • Hands-on troubleshooting mindset with strong analytical skills.

  • Ability to communicate complex technical issues clearly to customers.

  • Comfortable working in cleanroom and fab / OSAT environments.

  • Strong coordination skills across sales, engineering, and manufacturing teams.

  • Customer-oriented, responsive, and able to handle escalations. professionally.

  • Fluent in English and Chinese.

  • Qualification & Experience:

  • Bachelor's degree or diploma in engineering (Electrical, Mechatronics, Science or Physics in Product & Materials) or related field.

  • 3 - 5 years' experience in:

  • Experience supporting OSATs, foundries, or IDMs is highly preferred.

  • Product or Process Engineering related to wafer test.

  • Yield analysis and failure analysis concepts.

Note: Preferably in wafer-level testing or probe card industry. (Familiarity with Cantilever, Vertical, MEMS probe cards and WLT, WFT flows will be plus point).

  • Willingness to travel and support customers on-site.

Job Types: Full-time, Permanent

Pay: RM5,000.00 - RM7,000.00 per month

Benefits:

  • Opportunities for promotion
  • Parental leave
  • Professional development

Education:

  • Diploma/Advanced Diploma (Required)

Experience:

  • semiconductor: 3 years (Required)

Language:

  • Mandarin (Preferred)

License/Certification:

  • vehicle license (Required)

Work Location: In person

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