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Field Application Engineer _Thermal Testing Products

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Onsite

Field Application Engineer _Thermal Testing Products

Boyd

Field Application Engineer _Thermal Testing Products

Skills

RSales Ops

1 month ago

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Important information


Contract type:

Permanent

Location:

Shanghai, China

Work mode:

Onsite

Published on:

22 September 2026

What they need


Job Title: Field Application Engineer (FAE) - Thermal Testing Products

Company Overview

Boyd Corporation is the world's leading innovator in sustainable engineered materials and thermal solutions, specializing in high-performance Thermal Testing Products for semiconductor applications including memory/logic testing, ATE cooling systems, and direct-to-chip cooling technologies. As an FAE, you will play a pivotal role in bridging our cutting-edge thermal solutions with customer applications.

Key Responsibilities

  1. Technical Expertise & Support
  • Provide expert-level technical consultation on thermal testing solutions to customers and sales teams
  • Conduct in-depth product demonstrations and system evaluations
  • Troubleshoot complex thermal management issues in semiconductor testing environments
  1. Customer Collaboration
  • Work closely with customers to understand application requirements and propose optimal solutions
  • Develop customized thermal testing configurations for specific semiconductor applications
  • Provide on-site technical support and training
  1. Technical Liaison
  • Serve as primary technical contact between customers and R&D teams
  • Translate customer needs into technical specifications for product development
  • Provide competitive analysis and market feedback to engineering teams
  1. Pre-Sales & Post-Sales Support
  • Assist sales team with technical proposals and solution designs
  • Create application notes, white papers, and technical documentation
  • Manage technical escalations and ensure customer satisfaction

Qualifications & Requirements

Education: Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field

Experience:

  • 5+ years in field application engineering, preferably in semiconductor thermal solutions
  • Hands-on experience with thermal testing equipment (ATE systems, thermal chambers)
  • Strong understanding of cooling technologies (liquid/air cooling, heat sinks)

Skills:

  • Excellent problem-solving and analytical skills
  • Strong presentation and technical communication abilities
  • Ability to explain complex thermal concepts to non-technical audiences
  • Proficiency in thermal simulation tools (e.g., Fluent, Icepak) is a plus
  • Ability to work independently while collaborating with cross-functional teams
  • English, especially proficient reading and writing is a plus.

Why Join Our Team?

  • Opportunity to work with industry-leading thermal technologies
  • Dynamic work environment with technical challenges
  • Career growth in the fast-evolving semiconductor industry
  • Competitive compensation and benefits package

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