Flip chip工艺工程师

该职位来源于猎聘 *此职位的主要义务和职责

• Process Technology Development：  Lead in-depth research and value engineering development across key process technology modules, including ‌Mechanical Module (Thinning & Dicing‌, ‌Pick & Placement‌) ‌, Photonics (Laser‌, UV, Vision), Material (DAF, Compound), Chemical & Thermal Module.
• Module Excellence:  Develop advanced processes and interact with machines, material, products, etc. 

Drive optimization of process flow of NAND packaging, including but not limited to the process requirements and machine settings of

Flip chip process.

 Initial/maintain technology documents. Establish standardized technical documentation systems.

• New Product Introduction (NPI):  Oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production. Cross-functional collaboration frameworks (interface to design, testing, quality and production teams).
• Other interdepartmental process technology collaboration and technical support initiatives. 教育背景Education Bachelor's degree or above, majoring in physics, chemistry, chemical engineering, microelectronics, materials science or other related science and engineering fields. 知识Knowledge
• 职位要求的信息或知识范围 Statement of the Informational or conceptual framework required by the Job
• Be familiar with the process flow of NAND packaging, including but not limited to the process requirements and machine settings flip chip process.
• Demonstrated proficiency in utilizing diverse quality management methodologies and advanced data analysis software solutions. 相关工作经验Experiences
• More than 5 years of packaging or other semiconductor experience.
• Experience in automation/intelligent manufacturing is a plus. 其他胜任力Competencies &Soft Skill
• Good English skill, both written and oral
• Good communication and expression skills, strong self-learning motivation
• Organizational and coordination abilities, and a spirit of teamwork